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Press Releases

• Focus in 2017 on reaching higher with a portfolio of products designed to fit around how consumers live today and will connect in the

Collaboration to develop wide view angle full windshield heads-up display proof of concept for automotive market CES – LAS VEGAS – January 4, 2017 HARMAN

HARMAN to showcase Compute Platform that increasingly integrates connected technology CES – LAS VEGAS – January 4, 2017 HARMAN International (NYSE: HAR), the premier connected

User experience modes are demonstrated exclusively in the new Rinspeed Oasis concept vehicle CES – LAS VEGAS – January 4, 2017 HARMAN International (NYSE: HAR),

Award winning, compact subwoofer system designed with a removable base for extra cargo space CES 2017, Las Vegas – January 4, 2017 Today, HARMAN International

JBL BassPro Go is the first to market audio system for use both inside and outside the vehicle CES 2017, Las Vegas – January 4,

Latest experience-driven solutions to be demonstrated at the HARMAN Showcase located at the Hard Rock Hotel CES 2017, LAS VEGAS – January 4, 2017 Today,

HARMAN adds to its family of aftermarket hardware products that support connected applications to upgrade any car with a simple installation CES – LAS VEGAS

The new automotive cloud platform supports a one-stop ecosystem connecting all aspects of a device, from OTA updates to data analytics, with a heavy focus

We welcome today’s decision by the Competition and Markets Authority (CMA), regarding our planned acquisition of VocaLink. The thoroughness of the CMA’s review reflects the

JBL honors its long tradition of delivering industry-leading sound with the release of the classic-styled 4312SE monitor loudspeaker CES – LAS VEGAS – January 4,

The first ever turntable from Mark Levinson celebrates the 45th Anniversary of the brand CES – LAS VEGAS – January 4, 2017 At CES 2017,

Upcoming Volkswagen AG Vehicles to Feature Snapdragon 820A Processor, and Snapdragon X12 and X5 LTE Modems, to Deliver Compelling In-car Experiences JAN 4, 2017 LAS

Trials will be compliant with the expected 5G New Radio 3GPP specification, the global 5G standard; driving ecosystem towards rapid commercialization at scale JAN 4,

Qualcomm Technologies’ First 10nm System-on-Chip to Provide World-Class Performance and Enhanced Power Efficiency JAN 4, 2017 LAS VEGAS At CES® 2017 today, Qualcomm Incorporated (NASDAQ:

Built on 10-nanometer FinFET Technology, Snapdragon 835 Uniquely Delivers the Power Efficiency and Performance Required for the Compact and Sleek ODG R-8 and R-9 Mobile

Leading Module Makers Telit and Quectel to Offer First LTE Cat-M1 Modules Using Qualcomm Technologies’ MDM9206 LTE Modem With Support for Verizon’s ThingSpace Platform JAN

New platform unifies functionality through virtually seamless connectivity and delivers simplicity of use across devices and technologies JAN 4, 2017 LAS VEGAS Qualcomm Technologies, Inc.,

New Platform Solutions Using the Snapdragon X16 LTE Modem Help Automakers Integrate All Key Connectivity Technologies for Connected Cars JAN 4, 2017 LAS VEGAS At

Audi, Ericsson, Qualcomm Technologies, SWARCO Traffic Systems and the University of Kaiserslautern to Begin Testing Program in JAN 4, 2017 LAS VEGAS At CES® 2017

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