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CADENCE
CADENCE
May 28, 2023
Cadence Collaborates with Arm to Accelerate Mobile Device Silicon Success with New Arm Total Compute Solutions
CADENCE
May 11, 2023
Cadence Appoints Mary Louise Krakauer as Chair of the Board
CADENCE
Apr 26, 2023
Cadence Delivers New Design Flows Based on the Integrity 3D-IC Platform in Support of TSMC 3Dblox™ Standard
CADENCE
Apr 26, 2023
Cadence Digital and Custom/Analog Design Flows Certified for TSMC’s Latest N3E and N2 Process Technologies
CADENCE
Apr 26, 2023
Cadence Collaborates with GUC on AI, HPC and Networking in Advanced Packaging Technologies
CADENCE
Apr 25, 2023
Cadence Custom Design Migration Flow Accelerates Adoption of TSMC N3E and N2 Process Technologies
CADENCE
Apr 25, 2023
Cadence and TSMC Collaborate on N16 79GHz mmWave Design Reference Flow to Accelerate Radar, 5G and Wireless Innovation
CADENCE
Apr 24, 2023
Cadence Reports First Quarter 2023 Financial Results
CADENCE
Apr 24, 2023
Cadence Tapes Out 16G UCIe Advanced Package IP on TSMC’s N3E Process Technology
CADENCE
Apr 24, 2023
Cadence Accelerates Hyperscale SoC Design with Next-Generation 112G Extended Long-Reach SerDes IP on TSMC’s N4P Process
CADENCE
Apr 19, 2023
Cadence Unleashes the Future of Analog, Custom and RFIC Design with Pioneering AI-Powered Virtuoso Studio
CADENCE
Apr 18, 2023
49ers and Cadence Team Up on Multi-Year Technology Partnership Focused on Sustainability
CADENCE
Apr 17, 2023
Cadence Demonstrates Interoperability with SK hynix’s Highest Speed LPDDR5T Mobile DRAM at 9600Mbps
CADENCE
Apr 17, 2023
Cadence Extends Collaboration with TSMC and Microsoft to Advance Giga-Scale Physical Verification in the Cloud
CADENCE
Apr 13, 2023
Cadence Introduces EMX Designer, Delivering More Than 10X Increased Performance for On-Chip Passive Component Synthesis
CADENCE
Apr 11, 2023
Cadence Strengthens Tensilica Vision and AI Software Partner Ecosystem for Advanced Automotive, Mobile, Consumer and IoT Applications
CADENCE
Apr 6, 2023
Cadence Introduces Allegro X AI, Accelerating PCB Design with More Than 10X Reduction in Turnaround Time
CADENCE
Apr 4, 2023
Cadence Named One of the 2023 100 Best Companies to Work For® by Fortune and Great Place To Work®
CADENCE
Jan 18, 2023
GUC Delivers its First TSMC N3 Chip and First AI-Optimized N5 Design Using Cadence Digital Solutions
CADENCE
Jan 5, 2023
Cadence Tensilica HiFi DSP Enables Highly Energy-Efficient Audio Playback for Dolby Atmos for Cars
CADENCE
Dec 22, 2022
Cadence Announces Industry Best-In-Class 8533Mbps LPDDR5X IP Solution for Next-Generation AI, Automotive and Mobile Applications
CADENCE
Dec 12, 2022
Cadence Wins Six 2022 TSMC OIP Partner of the Year Awards
CADENCE
Nov 29, 2022
Cadence and UMC Certified mmWave Reference Flow Delivers First-Pass Silicon Success
CADENCE
Nov 15, 2022
Cadence Introduces Industry’s Leading-Performance, Silicon-Proven 22Gbps GDDR6 IP at TSMC N5
CADENCE
Oct 26, 2022
Cadence’s New Flow Automates Custom/Analog Design Migration on TSMC Advanced Technologies
CADENCE
Oct 26, 2022
Cadence Integrity 3D-IC Platform Certified for TSMC 3D Fabric Offerings
CADENCE
Oct 26, 2022
Cadence Accelerates RF Design with Delivery of New TSMC N16 mm Wave Reference Flow
CADENCE
Oct 26, 2022
Cadence Accelerates RF Design with Delivery of New TSMC N16 mmWave Reference Flow
CADENCE
Oct 26, 2022
Cadence Integrity 3D-IC Platform Certified for TSMC 3DFabric Offerings
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