At its second annual Intel Innovation event today, hardware and software developers gathered to hear Intel’s latest advancements toward an ecosystem built on the tenets of openness, choice and trust — from driving open standards to make “systems of chips” possible at the silicon level, to enabling efficient and portable multi-architecture artificial intelligence.
Intel also showcased an array of new hardware, software and services aimed at helping its broad ecosystem of developers overcome challenges and deliver new generations of innovation.
“In the next decade, we will see the continued digitization of everything. Five foundational technology superpowers — compute, connectivity, infrastructure, AI and sensing — will profoundly shape how we experience the world,” said Intel CEO Pat Gelsinger. “Developers, both software and hardware focused, will build this future. They are the true magicians that advance what’s possible. Fostering this open ecosystem is at the center of our transformation and the developer community is essential to our success.”
Boosting Developer Productivity with Early Hardware, Simplified AI
In his keynote to open the event, Gelsinger presented a number of challenges that developers face — vendor lock-in, access to the latest hardware, productivity and time-to-market, and security, to name a few — and introduced a multitude of solutions to help overcome them, including:
The Intel Developer Cloud, together with developer tools and resources designed to optimize performance including Intel® oneAPI toolkits and the Intel Geti platform, can help accelerate time to market for solutions built on Intel platforms.
Expanded Technology Portfolio Offers Flexibility and Choice
Gelsinger also used the occasion to present the latest advances across Intel’s product portfolio, including:
Many devices, one experience: Intel® Unison™ is a new software solution that provides seamless connectivity between phones (Android and iOS) and PCs — starting with functionality including file transfer, text messaging, phone calls and phone notifications — coming to new laptops starting later this year.
Systems Foundry Opens ‘New Era for Chipmaking’
Leaders from Samsung and TSMC joined Gelsinger in his keynote to voice support for the Universal Chiplet Interconnect Express (UCIe) consortium, which aims to create an open ecosystem for enabling chiplets designed and manufactured on different process technologies by different vendors to work together when integrated with advanced packaging technologies. With the three largest chipmakers and more than 80 of the leading companies in the semiconductor industry joining UCIe, “we are now making it a reality,” Gelsinger said.
To lead this platform transformation enabling new customer and partner solutions with chiplets, Gelsinger explained that “Intel and Intel Foundry Services will usher in the era of the systems foundry,” with four major components: wafer manufacturing, packaging, software and an open chiplet ecosystem. “Innovation once thought impossible has opened entirely new possibilities for chipmaking,” Gelsinger said.
Intel previewed another such innovation in development: a breakthrough pluggable co-package photonics solution. Optical connections hold promise to enable new levels of chip-to-chip bandwidth, particularly in the data center, but manufacturing difficulties make them untenably expensive. To overcome this, Intel researchers devised a robust, high-yielding, glass-based solution with a pluggable connector that simplifies manufacturing and lowers costs, opening possibilities for new system and chip package architectures in the future.
Building the future requires software, tools and products, and it also requires funding. Early this year, Intel launched the $1 billion IFS Innovation Fund to support early-stage startups and established companies building disruptive technologies for the foundry ecosystem. Today, the company announced the first round of companies that have received funding, a diverse group innovating across the entire semiconductor stack. The first round includes:
This is just the beginning of the news from Intel Innovation. Tune in at 8:30 a.m. PDT Wednesday to hear from Intel Chief Technology Officer Greg Lavender on how ubiquitous computing is creating endless opportunities for innovating at the speed of software and what Intel is doing to help developers unleash their potential. He’ll show more peeks into the future, and share the stage with a surprise guest, too.
1 World’s Best Gaming Experience based on performance and unique features of 13th Gen Intel® Core™ processors, including in comparison to 12th Gen Intel Core i9-12900K, AMD Ryzen 9 5950X, and AMD Ryzen 7 5800X3D, as of Sept. 7, 2022. See www.intel.com/PerformanceIndex for details.
Intel® Unison™ solution is currently only available on eligible Intel® Evo™ designs on Windows-based PCs and only pairs with Android- or iOS-based phones; all devices must run a supported OS version. See intel.com/performance-evo for details, including setup requirements. Results may vary.