SAN JOSE, Calif.— Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that it has won six Open Innovation Platform® (OIP) Partner of the Year awards from TSMC for its EDA, IP and cloud solutions. Cadence was presented with awards for the joint development of the N3E design infrastructure, 3Dblox™ Design Solution, analog migration flow, RF design solutions, cloud-based productivity solution and DSP IP. In addition, Cadence was recognized as a founding member of the TSMC 3DFabric™ Alliance.
The awards and 3DFabric Alliance member recognition are based on the collaborative work with TSMC highlighted below:
Cloud-Based Productivity Solution: Cadence expanded its cloud collaboration with TSMC by accelerating the physical verification of giga-scale digital designs via the Cadence Pegasus™ Verification System, which enables customers to speed design schedules and reduce compute costs.
“Each year, the TSMC OIP Partner of the Year awards give us an opportunity to recognize our industry ecosystem for their outstanding work in design enablement,” said Dan Kochpatcharin, head of the Design Infrastructure Management Division at TSMC. “Through our longstanding collaboration with Cadence, we’ve continued to work tirelessly to ensure our customers can use our latest technologies to design with confidence and stay ahead of the competition in their respective markets.”
“We have a long history of collaborating with TSMC to deliver key innovations that accelerate the design process and enable customers to achieve time-to-market goals,” said Dr. Chin-Chi Teng, senior vice president and general manager of the Digital & Signoff Group at Cadence.
“These prestigious TSMC awards and our participation in the 3DFabric Alliance underscore our commitment to enabling SoC design excellence via our Intelligent System Design strategy, and we are looking forward to our customers leveraging our latest technologies to develop their innovative, next-generation products across a wide range of end markets.”