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Apr 26, 2023
Xiaomi Unveils Climate Strategy for Supporting Global Net Zero GHG Emissions
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Apr 26, 2023
Digital.ai Empowers Organizations to More Intelligently Build and Deliver High Quality, Secure Software with New Release of AI-Powered DevOps Platform
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Apr 26, 2023
Melbourne Cricket Ground extends Siemens energy performance contract after A$5m savings
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Apr 26, 2023
Cadence Delivers New Design Flows Based on the Integrity 3D-IC Platform in Support of TSMC 3Dblox™ Standard
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Apr 26, 2023
Cadence Digital and Custom/Analog Design Flows Certified for TSMC’s Latest N3E and N2 Process Technologies
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Apr 26, 2023
Cadence Collaborates with GUC on AI, HPC and Networking in Advanced Packaging Technologies
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Apr 25, 2023
ASUS Republic of Gamers Announces Its First Windows 11 Gaming Handheld — the ROG Ally
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Apr 25, 2023
Takeover offer for GK Software successful. Remaining minority shareholders can tender their shares until May 9, 2023
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Apr 25, 2023
Siemens tech enables successful research at Zero Carbon Building Systems Lab
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Apr 25, 2023
Taiwan Web Service Partners with Pegatron to Enable 5G Private Cloud Enterprise Service
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Apr 25, 2023
Cadence Custom Design Migration Flow Accelerates Adoption of TSMC N3E and N2 Process Technologies
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Apr 25, 2023
Cadence and TSMC Collaborate on N16 79GHz mmWave Design Reference Flow to Accelerate Radar, 5G and Wireless Innovation
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Apr 24, 2023
HERE Technologies announces CEO Transition
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Apr 24, 2023
Cisco Unveils New Solution to Rapidly Detect Advanced Cyber Threats and Automate Response
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Apr 24, 2023
Cadence Reports First Quarter 2023 Financial Results
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Apr 24, 2023
Cadence Tapes Out 16G UCIe Advanced Package IP on TSMC’s N3E Process Technology
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Apr 24, 2023
Cadence Accelerates Hyperscale SoC Design with Next-Generation 112G Extended Long-Reach SerDes IP on TSMC’s N4P Process
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Apr 24, 2023
Intel, CrowdStrike and Zscaler Unveil Compatible Solutions for Zero Trust Security
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Apr 24, 2023
Lenovo Commended for Outstanding Program Leadership in Sustainable Procurement by EcoVadis
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Apr 23, 2023
Be Part of Disney’s ‘The Little Mermaid’ With Three New Enchanting LEGO Sets
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Apr 21, 2023
Viz.ai Wins 2023 Gold Edison Award™ for Innovation
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Apr 21, 2023
CESGA and Fujitsu establish quantum center in Galicia to develop and promote quantum technology
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Apr 21, 2023
Fujitsu joins G7 Digital and Tech Ministers’ Meeting to promotion of Japan’s digital technology through international communication and cooperation
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Apr 21, 2023
ASUS Announces 2023 Zenbook 15 OLED (UM3504)
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Apr 21, 2023
ASUS Announces Zenbook S 13 OLED, the World’s Slimmest 13.3″ OLED Laptop
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Apr 21, 2023
ASUS Thincredible Launch Event: Zenbook S 13 OLED, the World’s Slimmest OLED Ultraportable Laptop, and Vivobook x BAPE Collaboration Unveiled
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Apr 20, 2023
SwiftBot from Pudu Robotics Sets the Standard for Delivery Robots with iF Design Award Win
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Apr 20, 2023
URC Launches New TDC-5100 Premium Handheld Touch Screen With Hard Buttons
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Apr 20, 2023
Siemens consortium partners with Gujarat Metro Rail Corporation for advanced rail electrification technologies
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Apr 20, 2023
Saving the Desert with AI and Drones
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Apr 20, 2023
Fujitsu “CHRO Roundtable Report” offers insights from committee of leaders from some of Japan’s leading companies on people management strategies
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Apr 20, 2023
Fujitsu launches AI platform “Fujitsu Kozuchi,” streamlining access to AI and ML solutions to contribute to a sustainable society
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Apr 20, 2023
European Energy partners with Novo Nordisk and the LEGO Group to replace fossil-based materials in plastic production
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Apr 19, 2023
Fujitsu and BSC collaborate to advance research in personalized medicine and quantum computing
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Apr 19, 2023
Fujitsu launches ‘digital twin’ trial on Isle of Wight for e-scooter sharing service
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Apr 19, 2023
ASUS Wins Big at the 2023 iF Design Award, Cements Position in Top 10 Companies in Asia
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Apr 19, 2023
Telenet and Sandvine ‘QoE Project’ Rapidly Improves Customer Satisfaction and Reduces Churn
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Apr 19, 2023
Siemens strengthening opera in Egypt
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Apr 19, 2023
Cadence Unleashes the Future of Analog, Custom and RFIC Design with Pioneering AI-Powered Virtuoso Studio
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Apr 19, 2023
Intel Dives into the Future of Cooling
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